PACKAGE Datasheet(PDF) - G3VM3F - Omron Electronics LLC

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PACKAGE Folha de dados, PDF

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Palavra-chave pesquisada : 'PACKAGE' - Total: 27 (1/2) Pages

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
Omron Electronics LLC	G3VM3F	3Mb/86P	Wide Range of Contact Forms, Sizes and Package Types
	G3VM-VF	3Mb/86P	Wide Range of Contact Forms, Sizes and Package Types
	G3VM-61PR	941Kb/5P	MOS FET Relays USOP Package with High Load voltage 2015
	G3VM-66M	297Kb/6P	MOS FET Relay in module package with SPDT (1C)
	G8P-1A2T-F-DC5	1Mb/8P	Up to 30 A switching capacity in compact package.
	G3VM-61VY	81Kb/2P	Special SOP4-pin package with Dielectric strength AC 3.75 kV
	G3VM-61UR	1Mb/4P	VSON Package with Low Output Capacitance and Low ON Resistance
	CP1E-N40DR-A	2Mb/44P	The CP1E Package PLCs: Economical, Easy to use, and Efficient
	G3VM-41UR10	410Kb/4P	VSON package with Low Output Capacitance and ON Resistance type
	G3VM-21UR	192Kb/5P	VSON Package With Low Output Capacitance and Low On Resistance
	G3VM-21MT	2Mb/9P	MOS FET Relay in module package with very low leakage current
	G3VM-41AY1	283Kb/8P	Small DIP4 package with Dielectric Strength of 5,000 VAC between I/O
	G3VM-61BR1	503Kb/3P	Higher power, 3-A switching with a 60-V load voltage, DIP package.
	G3VM-21AR	432Kb/3P	Higher power, 3-A switching with a 20-V load voltage, DIP package.
	CPM2CS100C	288Kb/5P	CPM2C-S10C offers high-speed local control, remote expandability in a very compact package.
	G3VM-21ER	657Kb/4P	Higher Power, 4A switching with a 20V load, DIP package. Low 20 m廓 ON Resistance.
	G3VM-41QR10	261Kb/4P	World?셲 smallest class* New S-VSON Package with Low Output Capacitance and Low ON Resistance
	G3VM-41PR10	687Kb/3P	Smallest Class in market, USOP Package MOS FET Relays with Low Output Capacitance and ON Resistance
	G3VM-41PR12	979Kb/3P	Smallest Class in market, USOP Package MOS FET Relays with Low Output Capacitance and ON Resistance
	G3VM-21PR10	681Kb/3P	Smallest Class in market, USOP Package MOS FET Relays with Low Output Capacitance and ON Resistance

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O que é PACKAGE

Nas peças eletrônicas, o pacote significa um caso ou pacote usado para proteger e conectar dispositivos.

O pacote desempenha um papel importante na proteção e conexão de dispositivos.

Se o dispositivo não estiver devidamente protegido, as influências ambientais podem danificar ou destruir o dispositivo.

O pacote vem em várias formas e tamanhos, e existem vários tipos, dependendo do tipo e objetivo do dispositivo.

Os pacotes representativos incluem DIP (pacote duplo em linha), SOP (pacote de pequeno porte), QFP (pacote quad plank) e BGA (Ball Grid Array).

Um mergulho é um dos pacotes mais representativos e possui dois pinos colocados em linha.

Os POPs são pacotes menores que os quedas e têm uma forma retangular.

O QFP é um pacote com pinos paralelos à circunferência do pacote, e o BGA é um pacote no qual pequenos orifícios são perfurados na parte inferior dos elementos e pequenas contas são anexadas a eles para conectar os elementos.

Dependendo das características de cada pacote, ele é usado para vários propósitos.

Por exemplo, os DIPs são geralmente usados para circuitos integrados de baixa densidade, e os BGAs são usados para circuitos integrados de alta densidade.

*Esta informação é apenas para fins informativos gerais, não seremos responsáveis por qualquer perda ou dano causado pelas informações acima.

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