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PACKAGE Folha de dados, PDF

ALL A-BRIGHT Inc(45)ABLIC Inc.(10)Abracon Corporation(23)ACCUTEK MICROCIRCUIT CORPORATION(8)ACE Technology Co., LTD.(1)Actel Corporation(3)Acutechnology Semiconductor(10)Advanced Analog Technology, Inc.(2)Advanced Analogic Technologies(8)Advanced Crystal Technology(10)Advanced Micro Devices(14)Advanced Photonix, Inc.(24)Advanced Power Electronics Corp.(112)Advanced Power Technology(2)Advanced Semiconductor(4)Advanced Technical Materials Inc.(1)Advanced Thermal Solutions, Inc.(14)Advanced XTAL Products(87)Advantech Co., Ltd.(5)Aeroflex Circuit Technology(3)Agilent(Hewlett-Packard)(34)AIMTEC(1)AiT Semiconductor Inc.(3)All Sensors Corporation(6)Allegro MicroSystems(19)Allen-Bradley(1)Alliance Semiconductor Corporation(17)Allied Components International(3)Alpha & Omega Semiconductors(89)ALPS ELECTRIC CO.,LTD.(2)Altera Corporation(5)AMAZING Microelectronic Corp.(37)American Accurate Components, Inc.(5)American Microsemiconductor(52)AMIC Technology(4)Amkor Technology(21)Amphenol Corporation(4)Analog Devices(82)Analog Intergrations Corporation(1)Analog Microelectronics(1)Anaren Microwave(5)Anpec Electronics Coropration(2)Anshan Suly Electronics(1)API Delevan(3)Aries Electronics, Inc.(4)Asahi Kasei Microsystems(35)Astec America, Inc(2)ATMEL Corporation(3)AVAGO TECHNOLOGIES LIMITED(127)AVG Semiconductors(HITEK)(1)Avic Technology(1)AVX Corporation(1)BCM Advanced Research.(1)Bel Fuse Inc.(17)BetLux Electronics(15)Bi technologies(3)Bivar, Inc.(193)Bolymin, Inc(73)Bothhand USA, LP.(6)Bourns Electronic Solutions(9)BRIGHT LED ELECTRONICS CORP(41)Broadcom Corporation.(76)Bruckewell Technology LTD(2)Bud Industries, Inc.(1)C&D Technologies(1)C&K Components(3)California Eastern Labs(72)California Micro Devices Corp(9)CAMBION Electronic Components(4)Catalyst Semiconductor(3)Central Semiconductor Corp(39)Chicago Miniature Lamp,inc(9)CITIZEN ELECTRONICS CO., LTD.(98)Clairex Technologies, Inc(11)CML Microcircuits(3)Compensated Deuices Incorporated(4)Connor-Winfield Corporation(1)Continental Device India Limited(56)COSMO Electronics Corporation(23)Cree, Inc(1)Crydom Inc.,(5)Crystek Corporation(1)CTS Corporation(5)CUI INC(3)Cypress Semiconductor(4)Cystech Electonics Corp.(3)DAICO Industries, Inc.(1)Dallas Semiconductor(4)Datatronic Distribution, Inc.(3)DB Lectro Inc(14)Delta Electronics, Inc.(65)Dialight Corporation(13)Dialog Semiconductor(2)DinTek Semiconductor Co,.Ltd(1)Diodes Incorporated(37)DIYI Electronic Technology Co., Ltd.(2)E&E Magnetic Products Limited(3)E-SWITCH(45)E-Tech Electronics LTD(3)Ecliptek Corporation(1)ECS, Inc.(4)EHAOAN.(40)Elantec Semiconductor(1)Elite Enterprises (H.K.) Co., Ltd.(1)ELM Electronics(2)ELM Technology Corporation(34)Emerson Network Power(4)Enpirion, Inc.(1)Eon Silicon Solution Inc.(3)EPCOS(2)Epson Company(2)ESPRESSIF SYSTEMS (SHANGHAI) CO., LTD.(1)ETA SOLUTIONS CO. LIMITED(6)EUROQUARTZ limited(9)Eutech Microelectronics Inc(6)Everlight Electronics Co., Ltd(389)Exar Corporation(2)
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Palavra-chave pesquisada : 'PACKAGE' - Total: 27 (1/2) Pages
Fabricante ElectrônicoNome de PeçasFolha de dadosDescrição Electrónicos
Company Logo Img
Panasonic Semiconductor
JW1AFSN-DC12V-F Datasheet pdf image
116Kb/6P
Miniature package with universal Miniature package with universal
AN6914UBS Datasheet pdf image
36Kb/5P
Industrial Surface Mounting Package Comparator
AQV252G3S Datasheet pdf image
168Kb/5P
High capacity in a miniature SOP package
FK3306010L Datasheet pdf image
368Kb/6P
For switching FK350601 in SSSMini3 type package
DMC506E20R Datasheet pdf image
309Kb/3P
For high-frequency amplification DMC206E2 in SMini6 type package
DA3X108K0L Datasheet pdf image
311Kb/5P
For small current rectification DA2J108 in Mini3 type package
DB2S31400L Datasheet pdf image
328Kb/4P
For high speed switching circuits DB2J314 in SSMini2 type package
DA3X101A0L Datasheet pdf image
324Kb/5P
For high speed switching circuits DA3J101A in Mini3 type package
DB2U30800L Datasheet pdf image
335Kb/4P
For high speed switching circuits DB27308 in USSMini2 type package
AQZ264 Datasheet pdf image
648Kb/3P
High capacity up to 6A in a slim SIL package
DA3S102D0L Datasheet pdf image
335Kb/5P
For high speed switching circuits DA3J102D in SSMini3 type package
AGQ2001H Datasheet pdf image
125Kb/5P
High capacity 2 Amp, Flat and Compact package Telephone switchboard
DA3J103E0L Datasheet pdf image
312Kb/5P
For high speed switching circuits DA3X103E in SMini3 type package
FK3303010L Datasheet pdf image
282Kb/7P
Silicon N-channel MOSFET For switching FK350301 in SSSMini3 type package
AQY221R2MY Datasheet pdf image
78Kb/4P
Micro-miniature SON package Lower output capacitance and on resistance (C횞R10)
AEP25012 Datasheet pdf image
230Kb/8P
HIGH VOLTAGE AND CURRENT CUT-OFF CAPACITY IN A COMPACT PACKAGE
DRA5113Z0L Datasheet pdf image
415Kb/4P
For digital circuits Complementary to DRC5113Z DRA2113Z in SMini3 type package
FK3506010L Datasheet pdf image
366Kb/6P
Silicon N-channel MOS FET For switching FK330601 in SMini3 type package
DZ5S068D0R Datasheet pdf image
297Kb/4P
Silicon epitaxial planar type For surge absorption circuit DZ5J068D in SSMini5 type package
DMA90401 Datasheet pdf image
389Kb/4P
Silicon PNP epitaxial planar type For general amplification DMA50401 in SSMini6 type package

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O que é PACKAGE


Nas peças eletrônicas, o pacote significa um caso ou pacote usado para proteger e conectar dispositivos.

O pacote desempenha um papel importante na proteção e conexão de dispositivos.

Se o dispositivo não estiver devidamente protegido, as influências ambientais podem danificar ou destruir o dispositivo.

O pacote vem em várias formas e tamanhos, e existem vários tipos, dependendo do tipo e objetivo do dispositivo.

Os pacotes representativos incluem DIP (pacote duplo em linha), SOP (pacote de pequeno porte), QFP (pacote quad plank) e BGA (Ball Grid Array).

Um mergulho é um dos pacotes mais representativos e possui dois pinos colocados em linha.

Os POPs são pacotes menores que os quedas e têm uma forma retangular.

O QFP é um pacote com pinos paralelos à circunferência do pacote, e o BGA é um pacote no qual pequenos orifícios são perfurados na parte inferior dos elementos e pequenas contas são anexadas a eles para conectar os elementos.

Dependendo das características de cada pacote, ele é usado para vários propósitos.

Por exemplo, os DIPs são geralmente usados ​​para circuitos integrados de baixa densidade, e os BGAs são usados ​​para circuitos integrados de alta densidade.

*Esta informação é apenas para fins informativos gerais, não seremos responsáveis por qualquer perda ou dano causado pelas informações acima.


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