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PACKAGE Folha de dados, PDF

P-tec Corporation(550)Pan Jit International Inc.(8)Panasonic Battery Group(8)Panasonic Semiconductor(27)PANDUIT CORP.(1)Pasternack Enterprises, Inc.(74)PCA ELECTRONICS INC.(8)Peregrine Semiconductor(2)Peregrine Semiconductor Corp.(1)Pericom Semiconductor Corporation(13)PETERMANN-TECHNIK(14)PhaseLink Corporation(1)PHOENIX CONTACT(10)Pletronics, Inc.(1)Polyfet RF Devices(1)Power-One(8)Premier Magnetics, Inc.(9)Protek Devices(9)Pulse A Technitrol Company(5)Purdy Electronics Corporation(25)Qorvo, Inc(2)QT Optoelectronics(1)Quantum Research Group(1)QUARTZCOM the communications company(14)Quectel Wireless Solutions Co., Ltd.(2)Quelighting Corp(8)Raltron Electronics Corporation(6)RCD COMPONENTS INC.(1)Recom International Power(25)Rectron Semiconductor(11)Renesas Technology Corp(20)RF Micro Devices(2)RF Monolithics, Inc(26)RFHIC(9)Rhombus Industries Inc.(20)Richtek Technology Corporation(15)RICOH electronics devices division(3)Rochester Electronics(4)Rohm(65)Roithner LaserTechnik GmbH(28)RSG Electronic Components GmbH(7)Sames(1)Samsung semiconductor(5)Sangdest Microelectronic (Nanjing) Co., Ltd(7)Sanken electric(9)SanRex Corporation(6)Sanyo Semicon Device(9)SCHOTT CORPORATION(5)Seiko Instruments Inc(26)Seme LAB(528)Semtech Corporation(2)SEMTECH ELECTRONICS LTD.(1)Sensitron(3)Sensortechnics GmbH(3)Seoul Semiconductor(44)SGX Sensortech(2)Shanghai awinic technology co.,ltd(3)SHANGHAI BELLING CO., LTD.(1)Shanghai Leiditech Electronic Technology Co., Ltd(35)Shanghai Semitech Semiconductor Co., Ltd(12)Shanghai Shunye Electronics Co.,Ltd.(1)SHANTOU HUASHAN ELECTRONIC DEVICES CO.,LTD(28)Sharp Corporation(104)SHENZHEN FUMAN ELECTRONICS CO., LTD.(1)Shenzhen Huazhimei Semiconductor Co., Ltd(4)Shenzhen Luguang Electronic Technology Co., Ltd(8)SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.(3)SHENZHEN YONGERJIA INDUSTRY CO.,LTD(1)SHIKUES Electronics(14)Shindengen Electric Mfg.Co.Ltd(41)Shoulder Electronics Limited.(2)Siemens Semiconductor Group(49)Silan Microelectronics Joint-stock(4)Silicon Laboratories(3)Silonex Inc.(8)Sirectifier Global Corp.(1)SIRENZA MICRODEVICES(4)Skyworks Solutions Inc.(16)SMSC Corporation(8)Solid State Optronic(53)Solid States Devices, Inc(12)Solitron Devices Inc.(1)SPANSION(19)Stanford Microdevices(1)STANLEY ELECTRIC CO.,LTD.(14)Stanson Technology(8)StarHope(1)STATEK CORPORATION(1)STATS ChipPAC, Ltd.(1)STMicroelectronics(664)SunLED Corporation(295)Surge Components(3)Suzhou HangJing Electronic Technology Co., LTD(47)SynQor Worldwide Headquarters(3)TAI-SAW TECHNOLOGY CO., LTD.(2)TAITRON Components Incorporated(8)Taiwan Semiconductor Company, Ltd(4)Tak Cheong Electronics (Holdings) Co.,Ltd(47)TE Connectivity Ltd(5)Teccor Electronics(1)TelCom Semiconductor, Inc(1)Teledyne Technologies Incorporated(4)TEMEX(4)TEMIC Semiconductors(3)Texas Instruments(276)Texas Instruments(304)THine Electronics, Inc.(5)Thinki Semiconductor Co., Ltd.(35)Torex Semiconductor(7)Toshiba Semiconductor(21)Total Power International(37)Transcom, Inc.(2)Transko Electronics, Inc.(10)TRANSYS Electronics Limited(1)TriQuint Semiconductor(12)TT Electronics.(34)TXC Corporation.(10)Tyco Electronics(19)
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Palavra-chave pesquisada : 'PACKAGE' - Total: 25 (1/2) Pages
Fabricante ElectrônicoNome de PeçasFolha de dadosDescrição Electrónicos
Company Logo Img
Purdy Electronics Corpo...
AND4SA Datasheet pdf image
88Kb/2P
GaAsP Bright Red Light Emission Surface Mount Package
AND4WB Datasheet pdf image
112Kb/2P
InGaN Ultra Bright White Light Surface Mount Package
AND5SA Datasheet pdf image
55Kb/2P
GaAsP Bright Red Light Emission Surface Mount Package
AND4BA Datasheet pdf image
61Kb/2P
GaN Ultra Bright Blue Light Emission Surface Mount Package
AND5BA Datasheet pdf image
61Kb/2P
GaN Ultra Bright Blue Light Emission Surface Mount Package
AND4GA Datasheet pdf image
83Kb/2P
GaP Ultra Bright Green Light Emission Surface Mount Package
AND4WA Datasheet pdf image
215Kb/2P
InGaN Ultra Bright White Light Emission Surface Mount Package
AND5OA Datasheet pdf image
54Kb/2P
InGaAIP Ultra Bright Orange Light Emission Surface Mount Package
AND5BB Datasheet pdf image
97Kb/2P
InGaN Ultra Bright Blue Light Emission Surface Mount Package
AND5GA Datasheet pdf image
51Kb/2P
GaP Ultra Bright Green Light Emission Surface Mount Package
AND5RA Datasheet pdf image
51Kb/2P
GaAlAs Ultra Bright Red Light Emission Surface Mount Package
AND4OA Datasheet pdf image
51Kb/2P
InGaAlP Ultra Bright Orange Light Emission Surface Mount Package
AND5G Datasheet pdf image
54Kb/2P
GaP Ultra Bright Green Light Emission Surface Mount Package
AND4GRA Datasheet pdf image
66Kb/2P
InGaN Ultra Bright Green Light Emission Surface Mount Package
AND4RA Datasheet pdf image
51Kb/2P
GaAlAs Ultra Bright Red Light Emission Surface Mount Package
AND4YA Datasheet pdf image
49Kb/2P
InGaAlP Ultra Bright Yellow Light Emission Surface Mount Package
AND5YA Datasheet pdf image
51Kb/2P
InGaAlP Ultra Bright Yellow Light Emission Surface Mount Package
AND7GB Datasheet pdf image
124Kb/2P
InGaAIP Ultra Bright Green Light Low Profile Surface Mount Package
AND7WA Datasheet pdf image
120Kb/2P
InGaN Ultra Bright White Light Low Profile Surface Mount Package
AND5PGA Datasheet pdf image
51Kb/2P
GaP Ultra Bright Pure Green Light Emission Surface Mount Package

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O que é PACKAGE


Nas peças eletrônicas, o pacote significa um caso ou pacote usado para proteger e conectar dispositivos.

O pacote desempenha um papel importante na proteção e conexão de dispositivos.

Se o dispositivo não estiver devidamente protegido, as influências ambientais podem danificar ou destruir o dispositivo.

O pacote vem em várias formas e tamanhos, e existem vários tipos, dependendo do tipo e objetivo do dispositivo.

Os pacotes representativos incluem DIP (pacote duplo em linha), SOP (pacote de pequeno porte), QFP (pacote quad plank) e BGA (Ball Grid Array).

Um mergulho é um dos pacotes mais representativos e possui dois pinos colocados em linha.

Os POPs são pacotes menores que os quedas e têm uma forma retangular.

O QFP é um pacote com pinos paralelos à circunferência do pacote, e o BGA é um pacote no qual pequenos orifícios são perfurados na parte inferior dos elementos e pequenas contas são anexadas a eles para conectar os elementos.

Dependendo das características de cada pacote, ele é usado para vários propósitos.

Por exemplo, os DIPs são geralmente usados ​​para circuitos integrados de baixa densidade, e os BGAs são usados ​​para circuitos integrados de alta densidade.

*Esta informação é apenas para fins informativos gerais, não seremos responsáveis por qualquer perda ou dano causado pelas informações acima.


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