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PACKAGE Folha de dados, PDF

KEC(Korea Electronics)(406)Kemet Corporation(3)Kersemi Electronic Co., Ltd.(122)Keysight Technologies(1)Kingbor Technology Co(1)Kingston Technology Far East Co. Ltd(1)KOA Speer Electronics, Inc.(2)KODENSHI_AUK CORP.(51)KR Electronics, Inc.(5)Kyocera Kinseki Corpotation(1)Laird Tech Smart Technology(1)Lattice Semiconductor(1)Leshan Radio Company(48)LETEX TECHNOLOGY CORP.(1)LIGITEK electronics co., ltd.(1)Linear Dimensions Semiconductor(1)Linear Integrated Systems(2)Linear Technology(34)Linx Technologies(3)List of Unclassifed Manufacturers(54)List of Unclassifed Manufacturers(96)Lite-On Technology Corporation(46)Littelfuse(22)Lowpower Semiconductor inc(10)LUMEX INC.(8)Lumileds Lighting Company(36)Luminus, Inc(1)Luna Innovations Incorporated(17)LUXPIA(2)M-System Co.,Ltd.(3)M.S. Kennedy Corporation(42)M/A-COM Technology Solutions, Inc.(32)Macronix International(4)Marki Microwave(6)Marktech Corporate(5)Maxim Integrated Products(154)Mean Well Enterprises Co., Ltd.(24)Melexis Microelectronic Systems(2)Mercury United Electronics Inc(6)MIC GROUP RECTIFIERS(1)MICORO CRYSTAL SWITZERLAND(7)Micrel Semiconductor(8)Micro Commercial Components(6)Micro Electronics(9)Microchip Technology(5)Microdc power Technology Co., Ltd(10)Microdiode Electronics (Jiangsu) Co.,Ltd.(2)Micron Technology(1)Micronas(3)Micropac Industries(8)Microsemi Corporation(22)Micross Components(2)Mimix Broadband(3)Minilogic Device Corporation Limited(1)Minmax Technology Co., Ltd.(83)Mitsubishi Electric Semiconductor(389)MMD Components(48)Molex Electronics Ltd.(12)Molex Electronics Ltd.(13)Molex Electronics Ltd.(8)Molex Electronics Ltd.(28)Molex Electronics Ltd.(4)Molex Electronics Ltd.(4)Monolithic Power Systems(41)MORNSUN Science& Technology Ltd.(45)Morse Mfg. Co., Inc.(1)Mosel Vitelic, Corp(4)Mospec Semiconductor(1)Motorola, Inc(32)MPS Industries, Inc.(5)MTRONPTI(3)Murata Manufacturing Co., Ltd(3)Murata Manufacturing Co., Ltd.(8)Murata Power Solutions Inc.(3)MUSIC Semiconductors(1)Nais(Matsushita Electric Works)(4)Nanjing International Group Co(4)Nanjing Ouzhuo Technology Co., Ltd.(2)National Semiconductor (TI)(54)NEC(29)Nel Frequency Controls,inc(9)Nell Semiconductor Co., Ltd(9)New Japan Radio(3)New Jersey Semi-Conductor Products, Inc.(18)Newhaven Display International, Inc.(2)Nexperia B.V. All rights reserved(67)Nihon Inter Electronics Corporation(3)Nippon Precision Circuits Inc(2)Nisshinbo Micro Devices Inc.(2)Numonyx B.V(11)NXP Semiconductors(81)NXP Semiconductors(52)Ohmite Mfg. Co.(14)OKI electronic componets(10)Omron Electronics LLC(27)ON Semiconductor(219)OPTEK Technologies(35)OptoDiode Corp(2)Optoway Technology Inc(23)OSRAM GmbH(1013)
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Palavra-chave pesquisada : 'PACKAGE' - Total: 41 (1/3) Pages
Fabricante ElectrônicoNome de PeçasFolha de dadosDescrição Electrónicos
Company Logo Img
Monolithic Power System...
MP1522 Datasheet pdf image
202Kb/7P
25V Step-Up Converter in a SOT23-5 Package
MP1522 Datasheet pdf image
174Kb/6P
25V Step-Up Converter in a SOT23-5 Package
MP1909 Datasheet pdf image
986Kb/15P
30V, 2.2MHz, 2A Half-Bridge Gate Driver in SOT583 Package
Rev. 1.0 7/10/2020
MPM3683-7 Datasheet pdf image
827Kb/26P
2.7V-16V, 8A, Step-Down Power Module in QFN (7x7x4mm) Package
7/27/2020
MP2338 Datasheet pdf image
1Mb/25P
High-Efficiency, 28V, 3A, 450kHz, Synchronous Step-Down Converter In SOT583 Package
Rev. 1.0 12.11.2020
MP2615B Datasheet pdf image
881Kb/20P
2A, 1 Cell Li-ion Battery Charger In 3mm x 3mm Package
MP9459 Datasheet pdf image
1Mb/19P
17V, 4A, 600kHz, High-Efficiency,Synchronous, Step-Down Converter in an SOT563 Package
Rev. 1.0 1/13/2020
MP2615C Datasheet pdf image
1Mb/22P
2.1A, 1-Cell or 2-Cell Li-Ion Battery Charger in (3mmx3mm) Package
Rev. 1.1 6/15/2023
MPQ2459 Datasheet pdf image
887Kb/13P
0.5A, 55V, 480KHz, Step-Down Converter in a TSOT23-6 Package AEC-Q100 Qualified
MP1400 Datasheet pdf image
527Kb/15P
7V Input, 0.6A Peak, 1.5MHz Negative DCDC Power Converter In 8-ball CSP Package
MP2388 Datasheet pdf image
1Mb/18P
1A, 21V, 2MHz, High-Efficiency, Synchronous, Step-Down Converter in Ultra-Thin QFN Package
MP86920 Datasheet pdf image
1Mb/15P
Intelli-PhaseTM Solution with Integrated HS-/LS-FETs and Driver in LGA (4mmx5mm) Package
Rev. 1.0 12/22/2020
MP86998 Datasheet pdf image
1Mb/15P
Intelli-PhaseTM Solution with Integrated HS-/LS-FETs and Driver in TLGA (5mmx6mm) Package
Rev. 1.0 11/3/2020
MP2615 Datasheet pdf image
1Mb/21P
2A, 1- or 2- Cell Li-ion Battery Charger In 3mm x 3mm Package
MP2192 Datasheet pdf image
1Mb/22P
2A, 2.5V to 5.5V, Synchronous Step-Down Converter with 25μA IQ in CSP Package
Rev. 1.0 5/12/2021
MP8736 Datasheet pdf image
1Mb/23P
High Efficiency, Fast Transient, 6A, 19V Synchronous Buck Converter in a Tiny QFN20 (3x4mm) Package
MP38900 Datasheet pdf image
859Kb/23P
High Efficiency, Fast Transient, 10A, 16V Synchronous Step-down Converter In a Tiny QFN20 Package
MP2615A Datasheet pdf image
1Mb/21P
2 A, 1- or 2- Cell Li-Ion Battery Charger in 3mm x 3mm Package
MP3428 Datasheet pdf image
930Kb/20P
17A, 600kHz, 20V Wide Input Range, Synchronous Boost Converter in a small 3x4mm QFN Package
MP3422 Datasheet pdf image
456Kb/16P
6.5A, 600kHz High Efficiency, Synchronous Step-Up Converter with Output Disconnect in 2x2mm QFN Package

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O que é PACKAGE


Nas peças eletrônicas, o pacote significa um caso ou pacote usado para proteger e conectar dispositivos.

O pacote desempenha um papel importante na proteção e conexão de dispositivos.

Se o dispositivo não estiver devidamente protegido, as influências ambientais podem danificar ou destruir o dispositivo.

O pacote vem em várias formas e tamanhos, e existem vários tipos, dependendo do tipo e objetivo do dispositivo.

Os pacotes representativos incluem DIP (pacote duplo em linha), SOP (pacote de pequeno porte), QFP (pacote quad plank) e BGA (Ball Grid Array).

Um mergulho é um dos pacotes mais representativos e possui dois pinos colocados em linha.

Os POPs são pacotes menores que os quedas e têm uma forma retangular.

O QFP é um pacote com pinos paralelos à circunferência do pacote, e o BGA é um pacote no qual pequenos orifícios são perfurados na parte inferior dos elementos e pequenas contas são anexadas a eles para conectar os elementos.

Dependendo das características de cada pacote, ele é usado para vários propósitos.

Por exemplo, os DIPs são geralmente usados ​​para circuitos integrados de baixa densidade, e os BGAs são usados ​​para circuitos integrados de alta densidade.

*Esta informação é apenas para fins informativos gerais, não seremos responsáveis por qualquer perda ou dano causado pelas informações acima.


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