PACKAGE Datasheet(PDF) - NR8501 - California Eastern Labs

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PACKAGE Folha de dados, PDF

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Palavra-chave pesquisada : 'PACKAGE' - Total: 72 (1/4) Pages

Fabricante Electrônico	Nome de Peças	Folha de dados	Descrição Electrónicos
California Eastern Labs	NR8501	240Kb/6P	InGaAs APD IN COAXIAL PACKAGE FOR 2.5Gb/s APPLICATIONS
	NX6510GH	946Kb/6P	LASER DIODE IN COAXIAL PACKAGE FOR FIBER OPTIC COMMUNICATIONS
	NX7304BG	96Kb/4P	LASER DIODE IN COAXIAL PACKAGE FOR FIBER OPTIC COMMUNICATIONS
	NR8360JP-BC	85Kb/2P	30 um InGaAs APD IN DIP PACKAGE FOR OTDR APPLICATION
	PS2911-1-F3-M-A	494Kb/13P	HIGH CTR, 4-PIN ULTRA SMALL PACKAGE FLAT-LEAD PHOTOCOUPLER
	PS2911	766Kb/7P	NECs HIGH CTR, 4 PIN ULTRA SMALL PACKAGE FLAT LEAD OPTOCOUPLER
	NR7500	195Kb/5P	InGaAs PIN-PD IN COAXIAL PACKAGE FOR 2.5 Gbp/s APPLICATIONS
	NX7561	185Kb/4P	NECs 1550 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
	NX7529	190Kb/4P	NECs 1550 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
	NX8304BE-CC	105Kb/5P	InGaAsP MQW-DFB LASER DIODE IN COAXIAL PACKAGE FOR FIBER OPTIC COMMUNICATIONS
	NX7661	185Kb/4P	NECs 1625 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
	NX7528	190Kb/4P	NECs 1550 nm InGaAsP MQW FP PULSED LASER DIODE IN DIP PACKAGE
	NX7302BA-CC	101Kb/4P	InGaAsP MQW FP LASER DIODE IN COAXIAL PACKAGE FOR 622 Mb/s APPLICATIONS
	NX8300BE-CC	125Kb/5P	InGaAsP MQW DFB LASER DIODE IN COAXIAL PACKAGE FOR 2.5 Gb/s APPLICATION
	NX7303BA	100Kb/4P	InGaAsP MQW FP LASER DIODE IN COAXIAL PACKAGE FOR 155 Mb/s APPLICATION
	NE38018	68Kb/9P	GaAs HJ-FET L TO S BAND LOW NOISE AMPLIFIER (New Plastic Package)
	NE34018	200Kb/10P	GaAs HJ-FET L TO S BAND LOW NOISE AMPLIFIER (New Plastic Package)
	NR4500BP	98Kb/3P	InGaAs APD WITH INTERNAL PREAMPLIFIER IN COAXIAL PACKAGE FOR 2.5 Gb/s APPLICATIONS
	NR8501BP	241Kb/6P	NECs 50 關m InGaAs APD IN COAXIAL PACKAGE FOR 2.5Gb/s APPLICATIONS
	NR4500BP-CC	98Kb/3P	InGaAs APD WITH INTERNAL PREAMPLIFIER IN COAXIAL PACKAGE FOR 2.5 Gb/s APPLICATIONS

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O que é PACKAGE

Nas peças eletrônicas, o pacote significa um caso ou pacote usado para proteger e conectar dispositivos.

O pacote desempenha um papel importante na proteção e conexão de dispositivos.

Se o dispositivo não estiver devidamente protegido, as influências ambientais podem danificar ou destruir o dispositivo.

O pacote vem em várias formas e tamanhos, e existem vários tipos, dependendo do tipo e objetivo do dispositivo.

Os pacotes representativos incluem DIP (pacote duplo em linha), SOP (pacote de pequeno porte), QFP (pacote quad plank) e BGA (Ball Grid Array).

Um mergulho é um dos pacotes mais representativos e possui dois pinos colocados em linha.

Os POPs são pacotes menores que os quedas e têm uma forma retangular.

O QFP é um pacote com pinos paralelos à circunferência do pacote, e o BGA é um pacote no qual pequenos orifícios são perfurados na parte inferior dos elementos e pequenas contas são anexadas a eles para conectar os elementos.

Dependendo das características de cada pacote, ele é usado para vários propósitos.

Por exemplo, os DIPs são geralmente usados para circuitos integrados de baixa densidade, e os BGAs são usados para circuitos integrados de alta densidade.

*Esta informação é apenas para fins informativos gerais, não seremos responsáveis por qualquer perda ou dano causado pelas informações acima.

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