Os motores de busca de Datasheet de Componentes eletrônicos
  Portuguese  ▼
ALLDATASHEETPT.COM

X  



PACKAGE Folha de dados, PDF

P-tec Corporation(550)Pan Jit International Inc.(8)Panasonic Battery Group(8)Panasonic Semiconductor(27)PANDUIT CORP.(1)Pasternack Enterprises, Inc.(74)PCA ELECTRONICS INC.(8)Peregrine Semiconductor(2)Peregrine Semiconductor Corp.(1)Pericom Semiconductor Corporation(13)PETERMANN-TECHNIK(14)PhaseLink Corporation(1)PHOENIX CONTACT(10)Pletronics, Inc.(1)Polyfet RF Devices(1)Power-One(8)Premier Magnetics, Inc.(9)Protek Devices(9)Pulse A Technitrol Company(5)Purdy Electronics Corporation(25)Qorvo, Inc(2)QT Optoelectronics(1)Quantum Research Group(1)QUARTZCOM the communications company(14)Quectel Wireless Solutions Co., Ltd.(2)Quelighting Corp(8)Raltron Electronics Corporation(6)RCD COMPONENTS INC.(1)Recom International Power(25)Rectron Semiconductor(11)Renesas Technology Corp(20)RF Micro Devices(2)RF Monolithics, Inc(26)RFHIC(9)Rhombus Industries Inc.(20)Richtek Technology Corporation(15)RICOH electronics devices division(3)Rochester Electronics(4)Rohm(65)Roithner LaserTechnik GmbH(28)RSG Electronic Components GmbH(7)Sames(1)Samsung semiconductor(5)Sangdest Microelectronic (Nanjing) Co., Ltd(7)Sanken electric(9)SanRex Corporation(6)Sanyo Semicon Device(9)SCHOTT CORPORATION(5)Seiko Instruments Inc(26)Seme LAB(528)Semtech Corporation(2)SEMTECH ELECTRONICS LTD.(1)Sensitron(3)Sensortechnics GmbH(3)Seoul Semiconductor(44)SGX Sensortech(2)Shanghai awinic technology co.,ltd(3)SHANGHAI BELLING CO., LTD.(1)Shanghai Leiditech Electronic Technology Co., Ltd(35)Shanghai Semitech Semiconductor Co., Ltd(12)SHANTOU HUASHAN ELECTRONIC DEVICES CO.,LTD(28)Sharp Corporation(104)SHENZHEN FUMAN ELECTRONICS CO., LTD.(1)Shenzhen Huazhimei Semiconductor Co., Ltd(4)Shenzhen Luguang Electronic Technology Co., Ltd(8)SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.(3)SHENZHEN YONGERJIA INDUSTRY CO.,LTD(1)SHIKUES Electronics(14)Shindengen Electric Mfg.Co.Ltd(41)Shoulder Electronics Limited.(2)Shunye Enterprise(1)Siemens Semiconductor Group(49)Silan Microelectronics Joint-stock(4)Silicon Laboratories(3)Silonex Inc.(8)Sirectifier Global Corp.(1)SIRENZA MICRODEVICES(4)Skyworks Solutions Inc.(16)SMSC Corporation(8)Solid State Optronic(53)Solid States Devices, Inc(12)Solitron Devices Inc.(1)SPANSION(19)Stanford Microdevices(1)STANLEY ELECTRIC CO.,LTD.(14)Stanson Technology(8)StarHope(1)STATEK CORPORATION(1)STATS ChipPAC, Ltd.(1)STMicroelectronics(664)SunLED Corporation(295)Surge Components(3)Suzhou HangJing Electronic Technology Co., LTD(47)SynQor Worldwide Headquarters(3)TAI-SAW TECHNOLOGY CO., LTD.(2)TAITRON Components Incorporated(8)Taiwan Semiconductor Company, Ltd(4)Tak Cheong Electronics (Holdings) Co.,Ltd(47)TE Connectivity Ltd(5)Teccor Electronics(1)TelCom Semiconductor, Inc(1)Teledyne Technologies Incorporated(4)TEMEX(4)TEMIC Semiconductors(3)Texas Instruments(276)Texas Instruments(304)THine Electronics, Inc.(5)Thinki Semiconductor Co., Ltd.(35)Torex Semiconductor(7)Toshiba Semiconductor(21)Total Power International(37)Transcom, Inc.(2)Transko Electronics, Inc.(10)TRANSYS Electronics Limited(1)TriQuint Semiconductor(12)TT Electronics.(34)TXC Corporation.(10)Tyco Electronics(19)
More
Palavra-chave pesquisada : 'PACKAGE' - Total: 16 (1/1) Pages
Fabricante ElectrônicoNome de PeçasFolha de dadosDescrição Electrónicos
Company Logo Img
Skyworks Solutions Inc.
AAT4684 Datasheet pdf image
708Kb/14P
available in tsopjw-12 package
AAT4686 Datasheet pdf image
590Kb/13P
available in sc70jw-8 package
AAT4608 Datasheet pdf image
972Kb/9P
Current Limited Load Switch in a SOT23 Package
AAT3696 Datasheet pdf image
2Mb/21P
1.6A Li-Ion Battery Charger in a 3x3 TDFN Package
AAT3698 Datasheet pdf image
2Mb/21P
1.6A Linear Li-Ion Battery Charger in a 3x3 TDFN Package
AAT2113B Datasheet pdf image
3Mb/22P
3.3MHz, Fast Transient 1.5A Step-Down Converter in an 2mm x 2mm Package
AAT3692 Datasheet pdf image
2Mb/19P
Dual Input 1.6A Linear Charger with 28V OVP in a 3x4 TDFN Package
AAT3691 Datasheet pdf image
1Mb/18P
Dual Input 1.6A Linear Charger with 28V OVP in a 3x4 TDFN Package
SKY19243-686LF Datasheet pdf image
192Kb/2P
0.1 to 3.8 GHz SPDT High-Power Antenna Tuning Switch in a QFN Package
SKY19247-686LF Datasheet pdf image
197Kb/2P
0.8 to 2.7 GHz SP3T High-Power Antenna Tuning Switch in a QFN Package
SKY13449-001 Datasheet pdf image
395Kb/8P
0.5 to 3.0 GHz SP3T High-Power Antenna Tuning Switch in a WLCSP Package
SKY19245-686LF Datasheet pdf image
192Kb/2P
0.1 to 2.7 GHz SP4T High-Power Antenna Tuning Switch in a QFN Package
SKY19244-686LF Datasheet pdf image
194Kb/2P
0.1 to 2.7 GHz SP3T High-Power Antenna Tuning Switch in a QFN Package
SKY19237-001 Datasheet pdf image
175Kb/2P
0.7 to 2.7 GHz Triple SPST (3xSPST) Shunt MIPI Switch in a WLCSP Package
SKY19225-001 Datasheet pdf image
171Kb/2P
0.1 to 2.7 GHz SP4T High-Power Antenna Tuning Switch in a WLCSP Package
SKY13489-001 Datasheet pdf image
378Kb/8P
0.7 to 2.7 GHz SPDT High Power Switch (Single Bit Control) in a WLCSP Package

1


1



O que é PACKAGE


Nas peças eletrônicas, o pacote significa um caso ou pacote usado para proteger e conectar dispositivos.

O pacote desempenha um papel importante na proteção e conexão de dispositivos.

Se o dispositivo não estiver devidamente protegido, as influências ambientais podem danificar ou destruir o dispositivo.

O pacote vem em várias formas e tamanhos, e existem vários tipos, dependendo do tipo e objetivo do dispositivo.

Os pacotes representativos incluem DIP (pacote duplo em linha), SOP (pacote de pequeno porte), QFP (pacote quad plank) e BGA (Ball Grid Array).

Um mergulho é um dos pacotes mais representativos e possui dois pinos colocados em linha.

Os POPs são pacotes menores que os quedas e têm uma forma retangular.

O QFP é um pacote com pinos paralelos à circunferência do pacote, e o BGA é um pacote no qual pequenos orifícios são perfurados na parte inferior dos elementos e pequenas contas são anexadas a eles para conectar os elementos.

Dependendo das características de cada pacote, ele é usado para vários propósitos.

Por exemplo, os DIPs são geralmente usados ​​para circuitos integrados de baixa densidade, e os BGAs são usados ​​para circuitos integrados de alta densidade.

*Esta informação é apenas para fins informativos gerais, não seremos responsáveis por qualquer perda ou dano causado pelas informações acima.


Ligação URL :

Privacy Policy
ALLDATASHEETPT.COM
ALLDATASHEET é útil para você?  [ DONATE ] 

Sobre Alldatasheet   |   Publicidade   |   Contato conosco   |   Privacy Policy   |   roca de Link   |   Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com