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PACKAGE Folha de dados, PDF

P-tec Corporation(550)Pan Jit International Inc.(8)Panasonic Battery Group(8)Panasonic Semiconductor(27)PANDUIT CORP.(1)Pasternack Enterprises, Inc.(74)PCA ELECTRONICS INC.(8)Peregrine Semiconductor(2)Peregrine Semiconductor Corp.(1)Pericom Semiconductor Corporation(13)PETERMANN-TECHNIK(14)PhaseLink Corporation(1)PHOENIX CONTACT(10)Pletronics, Inc.(1)Polyfet RF Devices(1)Power-One(8)Premier Magnetics, Inc.(9)Protek Devices(9)Pulse A Technitrol Company(5)Purdy Electronics Corporation(25)Qorvo, Inc(2)QT Optoelectronics(1)Quantum Research Group(1)QUARTZCOM the communications company(14)Quectel Wireless Solutions Co., Ltd.(2)Quelighting Corp(8)Raltron Electronics Corporation(6)RCD COMPONENTS INC.(1)Recom International Power(25)Rectron Semiconductor(11)Renesas Technology Corp(20)RF Micro Devices(2)RF Monolithics, Inc(26)RFHIC(9)Rhombus Industries Inc.(20)Richtek Technology Corporation(15)RICOH electronics devices division(3)Rochester Electronics(4)Rohm(65)Roithner LaserTechnik GmbH(28)RSG Electronic Components GmbH(7)Sames(1)Samsung semiconductor(5)Sangdest Microelectronic (Nanjing) Co., Ltd(7)Sanken electric(9)SanRex Corporation(6)Sanyo Semicon Device(9)SCHOTT CORPORATION(5)Seiko Instruments Inc(26)Seme LAB(528)Semtech Corporation(2)SEMTECH ELECTRONICS LTD.(1)Sensitron(3)Sensortechnics GmbH(3)Seoul Semiconductor(44)SGX Sensortech(2)Shanghai awinic technology co.,ltd(3)SHANGHAI BELLING CO., LTD.(1)Shanghai Leiditech Electronic Technology Co., Ltd(35)Shanghai Semitech Semiconductor Co., Ltd(12)SHANTOU HUASHAN ELECTRONIC DEVICES CO.,LTD(28)Sharp Corporation(104)SHENZHEN FUMAN ELECTRONICS CO., LTD.(1)Shenzhen Huazhimei Semiconductor Co., Ltd(4)Shenzhen Luguang Electronic Technology Co., Ltd(8)SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.(3)SHENZHEN YONGERJIA INDUSTRY CO.,LTD(1)SHIKUES Electronics(14)Shindengen Electric Mfg.Co.Ltd(41)Shoulder Electronics Limited.(2)Shunye Enterprise(1)Siemens Semiconductor Group(49)Silan Microelectronics Joint-stock(4)Silicon Laboratories(3)Silonex Inc.(8)Sirectifier Global Corp.(1)SIRENZA MICRODEVICES(4)Skyworks Solutions Inc.(16)SMSC Corporation(8)Solid State Optronic(53)Solid States Devices, Inc(12)Solitron Devices Inc.(1)SPANSION(19)Stanford Microdevices(1)STANLEY ELECTRIC CO.,LTD.(14)Stanson Technology(8)StarHope(1)STATEK CORPORATION(1)STATS ChipPAC, Ltd.(1)STMicroelectronics(664)SunLED Corporation(295)Surge Components(3)Suzhou HangJing Electronic Technology Co., LTD(47)SynQor Worldwide Headquarters(3)TAI-SAW TECHNOLOGY CO., LTD.(2)TAITRON Components Incorporated(8)Taiwan Semiconductor Company, Ltd(4)Tak Cheong Electronics (Holdings) Co.,Ltd(47)TE Connectivity Ltd(5)Teccor Electronics(1)TelCom Semiconductor, Inc(1)Teledyne Technologies Incorporated(4)TEMEX(4)TEMIC Semiconductors(3)Texas Instruments(276)Texas Instruments(304)THine Electronics, Inc.(5)Thinki Semiconductor Co., Ltd.(35)Torex Semiconductor(7)Toshiba Semiconductor(21)Total Power International(37)Transcom, Inc.(2)Transko Electronics, Inc.(10)TRANSYS Electronics Limited(1)TriQuint Semiconductor(12)TT Electronics.(34)TXC Corporation.(10)Tyco Electronics(19)
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Palavra-chave pesquisada : 'PACKAGE' - Total: 21 (1/2) Pages
Fabricante ElectrônicoNome de PeçasFolha de dadosDescrição Electrónicos
Company Logo Img
Toshiba Semiconductor
2SC3378 Datasheet pdf image
134Kb/1P
MINI PACKAGE SERIES
2SK266 Datasheet pdf image
69Kb/1P
HSTM PACKAGE SERIES
8895CSNG7DN5 Datasheet pdf image
233Kb/1P
8895CSNG7DN5 / Toshiba / 64 Pin DIP Package
TH50VSF3680 Datasheet pdf image
585Kb/55P
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
TH50VSF2580AASB Datasheet pdf image
546Kb/50P
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
TH50VSF2582 Datasheet pdf image
548Kb/50P
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
SSM5H06FE Datasheet pdf image
163Kb/8P
Combined Nch MOSFET and Schottky Diode in one Package.
TLP598G Datasheet pdf image
180Kb/7P
Photo-MOS FET in a Six Lead Plastic DIP Package
TB67B000AHG Datasheet pdf image
455Kb/31P
TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP)
2019-05-30
TB67B000AFG Datasheet pdf image
454Kb/31P
TOSHIBA Bi-CMOS Power Integrated Circuit Multi-Chip Package (MCP)
2019-11-12
TMP91CP27U Datasheet pdf image
281Kb/2P
16-Bit Low Cost General Purpose Microcontroller in 64-pin Package
TCR2EN10 Datasheet pdf image
1Mb/15P
200 mA CMOS Low Drop-Out Regulator in ultra small package
U1JC44TE12L Datasheet pdf image
205Kb/4P
Average Forward Current Repetitive Peak Reverse Voltage Mini Plastic Mold Package
TCR2DG Datasheet pdf image
362Kb/15P
Low Noise 200 mA CMOS Low Drop-Out Regulator in ultra small package
TCK206G Datasheet pdf image
492Kb/12P
0.75 V, 2A Load Switch IC with Reverse Current Blocking in Ultra Small Package
TCK107G Datasheet pdf image
280Kb/11P
1.0 A Load Switch IC with Slew Rate Control Driver in Ultra Small Package
TCK207AN Datasheet pdf image
525Kb/11P
0.75 V, 2A Load Switch IC with Reverse Current Blocking in Ultra Small Package
TCR3UM Datasheet pdf image
846Kb/17P
Ultra low quiescent current, Fast Load Transient 300 mA CMOS Low Dropout Regulator in ultra small package
2021-11-16
TCR3UG Datasheet pdf image
707Kb/18P
Ultra low quiescent current, Fast Load Transient 300 mA CMOS Low Dropout Regulator in ultra small package
2022-01-11
TLP828 Datasheet pdf image
287Kb/6P
Photo-interrupter Which incorporates a GaAs infrared LED and a fast response Si Phototransistor in a Dust-proof package.

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O que é PACKAGE


Nas peças eletrônicas, o pacote significa um caso ou pacote usado para proteger e conectar dispositivos.

O pacote desempenha um papel importante na proteção e conexão de dispositivos.

Se o dispositivo não estiver devidamente protegido, as influências ambientais podem danificar ou destruir o dispositivo.

O pacote vem em várias formas e tamanhos, e existem vários tipos, dependendo do tipo e objetivo do dispositivo.

Os pacotes representativos incluem DIP (pacote duplo em linha), SOP (pacote de pequeno porte), QFP (pacote quad plank) e BGA (Ball Grid Array).

Um mergulho é um dos pacotes mais representativos e possui dois pinos colocados em linha.

Os POPs são pacotes menores que os quedas e têm uma forma retangular.

O QFP é um pacote com pinos paralelos à circunferência do pacote, e o BGA é um pacote no qual pequenos orifícios são perfurados na parte inferior dos elementos e pequenas contas são anexadas a eles para conectar os elementos.

Dependendo das características de cada pacote, ele é usado para vários propósitos.

Por exemplo, os DIPs são geralmente usados ​​para circuitos integrados de baixa densidade, e os BGAs são usados ​​para circuitos integrados de alta densidade.

*Esta informação é apenas para fins informativos gerais, não seremos responsáveis por qualquer perda ou dano causado pelas informações acima.


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