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PACKAGE Folha de dados, PDF

P-tec Corporation(550)Pan Jit International Inc.(8)Panasonic Battery Group(8)Panasonic Semiconductor(27)PANDUIT CORP.(1)Pasternack Enterprises, Inc.(74)PCA ELECTRONICS INC.(8)Peregrine Semiconductor(2)Peregrine Semiconductor Corp.(1)Pericom Semiconductor Corporation(13)PETERMANN-TECHNIK(14)PhaseLink Corporation(1)PHOENIX CONTACT(10)Pletronics, Inc.(1)Polyfet RF Devices(1)Power-One(8)Premier Magnetics, Inc.(9)Protek Devices(9)Pulse A Technitrol Company(5)Purdy Electronics Corporation(25)Qorvo, Inc(2)QT Optoelectronics(1)Quantum Research Group(1)QUARTZCOM the communications company(14)Quectel Wireless Solutions Co., Ltd.(2)Quelighting Corp(8)Raltron Electronics Corporation(6)RCD COMPONENTS INC.(1)Recom International Power(25)Rectron Semiconductor(11)Renesas Technology Corp(20)RF Micro Devices(2)RF Monolithics, Inc(26)RFHIC(9)Rhombus Industries Inc.(20)Richtek Technology Corporation(15)RICOH electronics devices division(3)Rochester Electronics(4)Rohm(65)Roithner LaserTechnik GmbH(28)RSG Electronic Components GmbH(7)Sames(1)Samsung semiconductor(5)Sangdest Microelectronic (Nanjing) Co., Ltd(7)Sanken electric(9)SanRex Corporation(6)Sanyo Semicon Device(9)SCHOTT CORPORATION(5)Seiko Instruments Inc(26)Seme LAB(528)Semtech Corporation(2)SEMTECH ELECTRONICS LTD.(1)Sensitron(3)Sensortechnics GmbH(3)Seoul Semiconductor(44)SGX Sensortech(2)Shanghai awinic technology co.,ltd(3)SHANGHAI BELLING CO., LTD.(1)Shanghai Leiditech Electronic Technology Co., Ltd(35)Shanghai Semitech Semiconductor Co., Ltd(12)SHANTOU HUASHAN ELECTRONIC DEVICES CO.,LTD(28)Sharp Corporation(104)SHENZHEN FUMAN ELECTRONICS CO., LTD.(1)Shenzhen Huazhimei Semiconductor Co., Ltd(4)Shenzhen Luguang Electronic Technology Co., Ltd(8)SHENZHEN REFOND OPTOELECTRONICS CO.,LTD.(3)SHENZHEN YONGERJIA INDUSTRY CO.,LTD(1)SHIKUES Electronics(14)Shindengen Electric Mfg.Co.Ltd(41)Shoulder Electronics Limited.(2)Shunye Enterprise(1)Siemens Semiconductor Group(49)Silan Microelectronics Joint-stock(4)Silicon Laboratories(3)Silonex Inc.(8)Sirectifier Global Corp.(1)SIRENZA MICRODEVICES(4)Skyworks Solutions Inc.(16)SMSC Corporation(8)Solid State Optronic(53)Solid States Devices, Inc(12)Solitron Devices Inc.(1)SPANSION(19)Stanford Microdevices(1)STANLEY ELECTRIC CO.,LTD.(14)Stanson Technology(8)StarHope(1)STATEK CORPORATION(1)STATS ChipPAC, Ltd.(1)STMicroelectronics(664)SunLED Corporation(295)Surge Components(3)Suzhou HangJing Electronic Technology Co., LTD(47)SynQor Worldwide Headquarters(3)TAI-SAW TECHNOLOGY CO., LTD.(2)TAITRON Components Incorporated(8)Taiwan Semiconductor Company, Ltd(4)Tak Cheong Electronics (Holdings) Co.,Ltd(47)TE Connectivity Ltd(5)Teccor Electronics(1)TelCom Semiconductor, Inc(1)Teledyne Technologies Incorporated(4)TEMEX(4)TEMIC Semiconductors(3)Texas Instruments(276)Texas Instruments(304)THine Electronics, Inc.(5)Thinki Semiconductor Co., Ltd.(35)Torex Semiconductor(7)Toshiba Semiconductor(21)Total Power International(37)Transcom, Inc.(2)Transko Electronics, Inc.(10)TRANSYS Electronics Limited(1)TriQuint Semiconductor(12)TT Electronics.(34)TXC Corporation.(10)Tyco Electronics(19)
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Palavra-chave pesquisada : 'PACKAGE' - Total: 664 (1/34) Pages
Fabricante ElectrônicoNome de PeçasFolha de dadosDescrição Electrónicos
Company Logo Img
STMicroelectronics
TO-220FP Datasheet pdf image
47Kb/2P
TRANSISTOR OUTLINE PACKAGE
STL120N4F6AG Datasheet pdf image
971Kb/15P
Wettable flank package
March 2017 Rev 4
POWERSO-10 Datasheet pdf image
85Kb/5P
10LEADS POWER SMALL OUTLINE PACKAGE
STEVAL-ILL073V1 Datasheet pdf image
284Kb/8P
Complete hardware and software package
January 2016 Rev 1
ESDA6V1-5T6 Datasheet pdf image
172Kb/11P
Lead-free and RoHS package
March 2011 Rev 2
SO-8 Datasheet pdf image
56Kb/5P
8-LEAD SMALL OUTLINE PACKAGE
TQFP64 Datasheet pdf image
128Kb/5P
64-LEAD THIN QUAD FLAT PACKAGE
AN1235 Datasheet pdf image
257Kb/14P
package description and recommendations for use
STB30N65DM6AG Datasheet pdf image
399Kb/15P
Power MOSFET in a D짼PAK package
June 2021
Z0402MB Datasheet pdf image
659Kb/11P
4 A - Triac in DPAK package
Rev 1 - September 2022
Z0402MH Datasheet pdf image
564Kb/10P
4 A - Triac in IPAK package
Rev 1 - September 2022
Z0405MH Datasheet pdf image
562Kb/10P
4 A - Triac in IPAK package
Rev 1 - September 2022
SMARTCARD Datasheet pdf image
31Kb/2P
Ordering Information For Package And Delivery
STPS120MF Datasheet pdf image
108Kb/7P
Power Schottky rectifier in flat package
AN4208 Datasheet pdf image
288Kb/16P
package description and recommendations for use
Z0409MB Datasheet pdf image
568Kb/11P
4 A - Triac in DPAK package
Rev 1 - September 2022
Z0410MH Datasheet pdf image
570Kb/10P
4 A - Triac in IPAK package
Rev 1 - September 2022
SSOP24 Datasheet pdf image
59Kb/4P
24-LEAD SHRINK SMALL OUTLINE PACKAGE
TQFP44 Datasheet pdf image
95Kb/5P
44-LEAD THIN QUAD FLAT PACKAGE
November 2004
Z0409MH Datasheet pdf image
567Kb/10P
4 A - Triac in IPAK package
Rev 1 - September 2022

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O que é PACKAGE


Nas peças eletrônicas, o pacote significa um caso ou pacote usado para proteger e conectar dispositivos.

O pacote desempenha um papel importante na proteção e conexão de dispositivos.

Se o dispositivo não estiver devidamente protegido, as influências ambientais podem danificar ou destruir o dispositivo.

O pacote vem em várias formas e tamanhos, e existem vários tipos, dependendo do tipo e objetivo do dispositivo.

Os pacotes representativos incluem DIP (pacote duplo em linha), SOP (pacote de pequeno porte), QFP (pacote quad plank) e BGA (Ball Grid Array).

Um mergulho é um dos pacotes mais representativos e possui dois pinos colocados em linha.

Os POPs são pacotes menores que os quedas e têm uma forma retangular.

O QFP é um pacote com pinos paralelos à circunferência do pacote, e o BGA é um pacote no qual pequenos orifícios são perfurados na parte inferior dos elementos e pequenas contas são anexadas a eles para conectar os elementos.

Dependendo das características de cada pacote, ele é usado para vários propósitos.

Por exemplo, os DIPs são geralmente usados ​​para circuitos integrados de baixa densidade, e os BGAs são usados ​​para circuitos integrados de alta densidade.

*Esta informação é apenas para fins informativos gerais, não seremos responsáveis por qualquer perda ou dano causado pelas informações acima.


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